They are studying the adhesion of thin SiCN films (40 to 120nm thick) deposited on Cu (a few µm) itself deposited on a 300mm Si substrate (550µm thick). They especially focus on the impact of the SiCN deposition process (and surface preparation) on the final adhesion energy.
They use an original approach based on the Colored Picosecond Acoustic Technique to evaluate adhesion in a quantitative manner. Such a technique uses ultra high frequency acoustic waves to probe the interface quality. they would like to compare our results to those obtained using a well-recognized technique like 4 points bend adhesion testing.
They are looking for a research group to collaborate with on that subject. An expertise on 4 points bend technique and especially applied to microelectronic samples and ultra-thin films is preferred.
Preliminary 4 points bending measurements on similar samples revealed an adhesion energy in the range 2 to 20 J/m2 . Those results have been obtained using a force not higher than 50 N and the displacement was in the range 60-80 µm before delamination.
For more information, or collaboration please contact Dr. Arnaud Devos, at IEMM, Lille in France (firstname.lastname@example.org)
The Max-Planck-Institut für Eisenforschung GmbH (MPIE) and Bruker are pleased to announce Nanobrücken 2020: Nanomechanical Testing Conference & Bruker User Meeting, which will take place February 4–6 at MPIE located in Düsseldorf, Germany.
Please save the date in your calendar and register to secure your seat at Nanobrücken 2020. Topics will include advanced nanoindentation and associated techniques, in-situ testing in SEM/TEM, theory/simulation and biomechanical testing:
- Discover new trends in nanomechanical and nanotribological testing
- Learn from internationally renowned researchers
- Participate in hands-on, practical workshops
- Network and collaborate during nightly social events
- Student talk and poster competitions
Abstract Submission Deadline: Friday, November 29, 2019.
More information can be found here.
The International Conference on Metallurgical Coatings and Thin Films (ICMCTF) is the premier international conference in the field of thin film deposition , characterization , and advanced surface engineering. Focus on two symposium:
Symposium H: Advanced Characterization Techniques for Coatings, Thin Films, and Small Volumes
Chairs: Benoit Merle (University Erlangen-Nürnberg (FAU), Germany) and Marco Sebastiani (Roma TRE University, Italy)
This symposium focuses on recent advances in the structural, microstructural, and mechanical characterization of coatings and thin films, which enhance our understanding of the growth and surface modification processes as well as the fundamental structure-property-processing relationships. Of interest are contributions that either highlight the application of, or draw attention to, recent advances in analytical methods, characterization techniques, and novel nano-mechanical testing methods for coating evaluation. Analytical methods may include numerical evaluation and quantification procedures (e.g., factor analysis, depth profiling, 3D mapping, etc.) to reveal the micro- and nano-structure, chemical composition, residual stress, chemical states, and phases of coatings, thin films, interfaces, and surfaces during or after surface modification. Micro- and nanomechanical methods may include compression, bending, or toughness testing to determine coating behavior, particularly at elevated/service temperatures and in harsh environments, and the relationship to coating performance and lifetime. Residual stress analysis, phase characterization, surface topography probes, compositional analysis, high-resolution spatial imaging and analysis, and hardness measurements continue to be subjects of interest in the sessions. In-situ characterization methods and other novel techniques presenting the combination between microstructural nano-mechanical probes are highly encouraged.
- H1: Spatially-resolved and In-Situ Characterization of Thin Films and Engineered Surfaces
- H2: Advanced Mechanical Testing of Surfaces, Thin Films, Coatings and Small Volumes
- H3: Characterization of Coatings and Small Volumes in Harsh Environments
Symposium E: Tribology and Mechanical Behavior of Coatings and Engineered Surfaces
Particular focus on:
E2: Mechanical Properties and Adhesion:
This session is devoted to the measurement and modeling of mechanical properties of surface and near-surface regions of thin films, coatings, and surface-engineered bulk materials. We are interested in measurement methods and models for the quantitative determination of mechanical properties, residual stresses, interface adhesion, fatigue, and fracture toughness. Emphasis will be given to contributions on novel test methods, such as in situ testing in SEM or TEM, multi-axial contact mechanics, MEMS test beds, and new approaches for the extraction of mechanical and constitutive properties by modeling of indentation load-displacement curves. Finally, special consideration will be given to contributions that address processing-structure- mechanical property relationships across multiple length scales.
Invited Speakers: Bo-Shiuan Li (University of Oxford, UK) and Corinne Packard (Colorado School of Mines, USA, “Controlled Spalling of Microscale, Single-Crystal Films of High-Quality, High-Value Semiconductors”)
Call for Abstracts Deadline: October 1, 2019
For more information, and submission please follow the link: icmctf2020.avs.org
Comme chaque année, l'association Mécamat tiendra son colloque national au Centre Paul Langevin du CNRS à Aussois (Savoie) du 20 au 24 janvier 2020 et abordera la problématique des contraintes résiduelles autour de quatre sessions thématiques :
- Contraintes résiduelles et procédés
- Nouveaux outils d'analyse
- Durabilité et intégrité à l'usage
- De l'élaboration à la durée de vie
Sur une semaine, le colloque proposera un état de l'art exhaustif de cette thématique. Des exposés longs seront présentés par les meilleurs spécialistes, et de larges espaces réservés pour la discussion. Cadre, hébergement et programme font des colloques d'Aussois des lieux d'échanges privilégiés, en particulier pour les jeunes chercheurs.
Les doctorants sont invités à présenter leurs travaux lors de la Session Posters organisée le mardi après-midi, sans restriction particulière au thème du colloque.Les inscriptions seront ouvertes du 1er septembre au 14 octobre 2019. L'adresse de contact est email@example.com
Plus d'informations, sur le contenu du colloque, sont disponibles dans le document ci-joint: «MECAMAT_programme.pdf »
The SRMP at CEA Saclay is offering a 1 year contract for a scientist position, opened immediately, to perform TEM analysis (In situ, EELS, high resolution) on Iron-based alloys.
Contact : Jean-Luc BÉCHADE (firstname.lastname@example.org)
Chef du Service de Recherches de Métallurgie Physique
CEA - Centre de Saclay
DEN/DANS/DMN/SRMP - bât. 520
91191 Gif-sur-Yvette Cedex
tél : (+33) 1.69.08.28.10
fax : (+33) 1.69.08.68.67
Fully operational on TEM for metallic materials (associated techniques : EELS, MET-HR…), with a specialization in sin situ TEM straining.
Good knowledge of irradiation defects.
Education: Master needed, PhD with a specialization in TEM would be a plus.
Detail below (in French)