• Symposium on “ Advanced modelling techniques: scale bridging” at the EMMC17,  in Madrid (Spain). It will be held from May 27th to May 29th, 2020. 

    Short description: 

    Multi-scale techniques and scale bridging play a key role in connecting the macroscopic behaviour of materials directly to the material microstructure and elementary deformation processes. Many different classes of scale bridging methods have been developed for this purpose, from the atoms to the continuum scale. These generally involve multiple disciplines, e.g., engineering, computational mechanics, mathematics, physics, chemistry, and so on. This session is intended as a forum for bringing together scientists from different disciplines working on multi-scale techniques and scale-bridging problems in mechanics of materials, including both spatial, as well as temporal scales.

    The topics to be addressed in this session include (but are not limited to):

    • homogenization-based methods, e.g. mathematical homogenization, computational homogenization etc.
    • atomistic-to-continuum coupling methods (e.g. the quasi-continuum method)
    • dislocation Dynamics based methods (e.g. DD-FEM coupling) 
    • embedded domain methods, domain decomposition methods, global-local techniques
    • heterogeneous multi-scale method (HMM), equation-free method
    • coarse graining methods
    • atomic time scale extension techniques
    • methods for phenomena with (partially) non-separating scales, e.g. localization, damage and fracture or transient phenomena
    • methods for coupled multi-field phenomena (e.g. thermo-chemo-electro-mechanical etc.)
    • model reduction techniques and reduction of computational costs associated with multiscale algorithms

     

    More information : http://www.emmc17.org/symposium-s16.html

    Deadline for the abstract submission is on December 3rd, 2019. December 16th,2019.


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  • Description of the Symposium by the organizers:

    "Dear GDRi network,

    the 17th European Mechanics of Materials conference will be held from 27th to 29th of May 2020 in Madrid, Spain. The conference covers several different aspects of mechanics – including experimental methods to understand the mechanical behavior of various materials across all length scales. Part of the conference will be a symposium on “Experimental Nanomechanics” organized by Frédéric Mompiou (CEMES Toulouse, France) and Christoph Kirchlechner (MPIE Düsseldorf, Germany).

    The symposium focuses on nano- and micromechanical testing coupled with advanced in situ techniques. Characterization techniques envisioned comprise (but are not limited to) transmission electron microscopy (TEM), scanning electron microscopy (SEM) and synchrotron-based techniques. The contributions should aim for understanding plasticity, fracture and fatigue at

    • grain and phase boundaries
    • amorphous / crystalline interfaces
    • free surfaces
    • multilayered systems
    • super lattices

     

    More information can be found at http://www.emmc17.org/symposium-s13.html .

    Please note the deadline for abstract submission is on 3rd  of December. December 16th, 2019.

    Best regards

    Frédéric Mompiou and Christoph Kirchlechner"


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  • The Institut Pprime is looking for two master student (last year) for internship on nanotwinned gold thin films.

    First internship:

    Subject: Atomic scale simulations of nanotwinned gold thin films.

    Aim: The aim of this internship is to establish via atomistic scale simulations the elastic strain field associated with different nanotwinned thin film microstructures. Equilibrium conditions will be determined using semi-empirical potentials, that are reliable for gold. In a first step, a simple configuration with a unique twin and periodic boundary conditions will be worked out. This will allow studying the impact of the twins’ density and thickness.More sophisticated and larger systems will then be considered, with several twins having different orientations.

    Dates: the internship is available from February to September 2020, with a vacation period in August.

    Required skills: Applicant has to be in final year of Master and/or engineering school with a background in solid-state physics or materials science. A strong interest in computer simulations.

    More information on the subject, and application can be found in the following document:

    « stage_M2_Brochard-Durinck_PtyMet_2019_en.pdf »

    Second internship:

    Subject: Preparation and characterization of homogeneous nanotwinned gold thin films

    Aim: Various optimizations of the sputtering conditions are envisaged: deposition temperature, substrate, acceleration voltage, etc. The student will work with several techniques:

    • Physical vapor deposition (sputtering) of the thin films.
    • Transmission electron microscopy (TEM) (i) bright field images with large field of view of the sample, (ii) dark field images to select one chosen twin family, (iii) in high-resolution mode to show the roughness of the twin boundaries.
    • X-Ray diffraction to determine with pole figures the twinned volume on a representative (millimetric) scale.
    • Focused ion beam to prepare thin foils for TEM and to observe the film surfaces in scanning electron microscopy.

    Dates: The internship is available from February to September 2020, with a vacation period in August.

    Required skills: Applicant has to be in final year of Master and/or engineering school with a background in solid-state physics or materials science. A strong interest in computer simulations.

    More information on the subject, and application can be found in the following document:

    « stage_M2_Michel_Renault_PtyMet_2019_en.pdf »


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  • They are studying the adhesion of thin SiCN films (40 to 120nm thick) deposited on Cu (a few µm) itself deposited on a 300mm Si substrate (550µm thick). They especially focus on the impact of the SiCN deposition process (and surface preparation) on the final adhesion energy.

    They use an original approach based on the Colored Picosecond Acoustic Technique to evaluate adhesion in a quantitative manner. Such a technique uses ultra high frequency acoustic waves to probe the interface quality. they would like to compare our results to those obtained using a well-recognized technique like 4 points bend adhesion testing.

    They are looking for a research group to collaborate with on that subject. An expertise on 4 points bend technique and especially applied to microelectronic samples and ultra-thin films is preferred.

    Preliminary 4 points bending measurements on similar samples revealed an adhesion energy in the range 2 to 20 J/m2 . Those results have been obtained using a force not higher than 50 N and the displacement was in the range 60-80 µm before delamination.

    For more information, or collaboration please contact Dr. Arnaud Devos, at IEMM, Lille in France (arnaud.devos@isen.fr)


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  • The Max-Planck-Institut für Eisenforschung GmbH (MPIE) and Bruker are pleased to announce Nanobrücken 2020: Nanomechanical Testing Conference & Bruker User Meeting, which will take place February 4–6 at MPIE located in Düsseldorf, Germany.

    Please save the date in your calendar and register to secure your seat at Nanobrücken 2020. Topics will include advanced nanoindentation and associated techniques, in-situ testing in SEM/TEM, theory/simulation and biomechanical testing:

    • Discover new trends in nanomechanical and nanotribological testing
    • Learn from internationally renowned researchers
    • Participate in hands-on, practical workshops
    • Network and collaborate during nightly social events
    • Student talk and poster competitions

     

    Abstract Submission Deadline: Friday, November 29, 2019.

    More information can be found here.


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