The "Nano- / Micromechanics" group in department "Structure and Nano‐ / and Micromechanics of Materials“, is looking for a postdoctoral researcher (m/f) and a PhD student (m/f) :
"Micro cantilever fracture testing of hard coatings with superior fracture properties"
The work will be focused on in situ experiments applying advanced characterization methods like scanning electron microscopy, focused ion beam milling and high temperature micro fracture testing. Highly motivated candidates should hold a PhD in materials science or physics. Experience in scanning electron microscopy as well as fracture mechanics is appreciated.
"In situ nano‐ and micromechanics investigating dislocation‐grainboundary interactions"
The work will be focused on in situ experiments applying advanced characterization methods like synchrotron‐based micro Laue diffraction (μLaue) and scanning electron microscopy (SEM, EBSD, FIB). The PhD candidate will join an internationally recognized and highly motivated team of scientists involved in the field of micromechanics of materials.
More information are available in the documents below (German and English version) and at www.mpie.de.
3D integration involves vertically stacking of several integrated circuits and establishing electrical connections between them. Although 3D interconnect technologies have obvious advantages and their manufacturing process has almost reached the status of mass production, there are several reliability issues, as is often the case in emerging technologies. Electromigration is one of those concerns.
- PhD degree in Computer Science, Engineering, Mathematics, or Physics; basics of microelectronic technologies with emphasis on 3D interconnect schemes will be a plus.
- Good knowledge and interest in multiphysics (material science, mechanics, heat science), modeling (FEM [COMSOL especially], phase field method) is an asset.
This internship will take place in the characterization and reliability lab. in conjunction with the simulation and modelling one in a technological and scientific research environment.
For further information or for application, please contact Stéphane MOREAU (firstname.lastname@example.org) and Olga CUETO (email@example.com).
More information on the subject and work description are available in the documents below :(French (Fr) and English (Gb) version)
Four conferences related to the themes of mechanical strength of materials, defects in semiconductors, mechanics and TEM have abstract submission deadlines approaching very fast :
- ICSMA (July 2018, Ohio): the deadline for abstracts submission is January 15th, 2018.
- EDS (June 2018, Greece): the deadline for abstract submission is February 19th, 2018.
- European Society for Experimental Mechanics (EuraSEM). (www.icem18.org) Brussels, July 1- 7th, 2018. A session on “Micro- and nano-scale mechanical testing” is organized. Deadline January 15th, 2018.
- http://imc19.com/ : International Microscopy Conference, Australia, 9-14 sept 2018. Many symposia related to interface, small scale structures, in situ. Deadline for abstract submission: February 1st, 2018.