Four conferences related to the themes of mechanical strength of materials, defects in semiconductors, mechanics and TEM have abstract submission deadlines approaching very fast :

• ICSMA (July 2018, Ohio): the deadline for abstracts submission is January 15th, 2018.

• EDS (June 2018, Greece): the deadline for abstract submission is February 19th, 2018.

• European Society for Experimental Mechanics (EuraSEM).  (www.icem18.org) Brussels, July 1- 7th, 2018.  A session on “Micro- and nano-scale mechanical testing” is organized. Deadline January 15th, 2018.

• http://imc19.com/ : International Microscopy Conference, Australia, 9-14 sept 2018. Many symposia related to interface, small scale structures, in situ. Deadline for abstract submission: February 1st, 2018.