Post-Doctoral position for Mass-transport degradation of interconnects for 3-D IC, toward a predictive modeling - at CEA-Grenoble, France

Subject:

3D integration involves vertically stacking of several integrated circuits and establishing electrical connections between them. Although 3D interconnect technologies have obvious advantages and their manufacturing process has almost reached the status of mass production, there are several reliability issues, as is often the case in emerging technologies. Electromigration is one of those concerns.

Profile:

• PhD degree in Computer Science, Engineering, Mathematics, or Physics; basics of microelectronic technologies with emphasis on 3D interconnect schemes will be a plus.
• Good knowledge and interest in multiphysics (material science, mechanics, heat science), modeling (FEM [COMSOL especially], phase field method) is an asset.

Mentors/supervisors:

This internship will take place in the characterization and reliability lab. in conjunction with the simulation and modelling one in a technological and scientific research environment.

For further information or for application, please contact Stéphane MOREAU (stephane-nico.moreau@cea.fr) and Olga CUETO (olga.cueto@cea.fr).

More information on the subject and work description are available in the documents below :(French (Fr) and English (Gb) version)

• Download « 2017_postdoc_EM_vFR.pdf »
• Download « 2017_postdoc_EM_vGB.pdf »