• Comme chaque année, l'association Mécamat tiendra son colloque national au Centre Paul Langevin du CNRS à Aussois (Savoie) du 20 au 24 janvier 2020 et abordera la problématique des contraintes résiduelles autour de quatre sessions thématiques :

     

    • Contraintes résiduelles et procédés
    • Nouveaux outils d'analyse
    • Durabilité et intégrité à l'usage
    • De l'élaboration à la durée de vie

     

    Sur une semaine, le colloque proposera un état de l'art exhaustif de cette thématique. Des exposés longs seront présentés par les meilleurs spécialistes, et de larges espaces réservés pour la discussion. Cadre, hébergement et programme font des colloques d'Aussois des lieux d'échanges privilégiés, en particulier pour les jeunes chercheurs.

    Les doctorants sont invités à présenter leurs travaux lors de la Session Posters organisée le mardi après-midi, sans restriction particulière au thème du colloque.Les inscriptions seront ouvertes du 1er septembre au 14 octobre 2019. L'adresse de contact est aussois2020@sciencesconf.org

    Plus d'informations, sur le contenu du colloque, sont disponibles dans le document ci-joint: «MECAMAT_programme.pdf »


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  • The SRMP at CEA Saclay is offering a 1 year contract for a scientist position, opened immediately, to perform TEM analysis (In situ, EELS, high resolution) on Iron-based alloys.

     

    Contact : Jean-Luc BÉCHADE (jean-luc.bechade@cea.fr) 

    Chef du Service de Recherches de Métallurgie Physique

    CEA - Centre de Saclay

    DEN/DANS/DMN/SRMP - bât. 520

    91191 Gif-sur-Yvette Cedex

    tél : (+33) 1.69.08.28.10

    fax : (+33) 1.69.08.68.67

     

    Background :

    Fully operational on TEM for metallic materials  (associated techniques : EELS, MET-HR…), with a specialization in sin situ TEM straining.

    Good knowledge of irradiation defects. 

     

    Education: Master needed, PhD with a specialization in TEM would be a plus.  

    Detail below (in French)

     


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  • IMDEA Materials (Madrid Institute for Advanced Studies of Materials) is seeking for an innovative and skilled microscopist able to contribute to the application of advanced microscopy techniques (FIB, SEM, EBSD, EDS, TEM) to the characterization of materials, including the use of these techniques to carry out in-situ mechanical tests at the micro and nanoscale.

    The selected candidate will assist other researchers (including external users) in the use of the microscopy facilities, will manage the electron microsocopy lab,  and will be encouraged to develop his own research lines in the area of electron microscopy.

     Requirements:

    Candidates should have a PhD in Materials Engineering or Physics.

    The applicant must be an experienced transmission electron microscopist, with accredited experience in:

    • High-resolution electron microscopy (HREM).
    • Electron diffraction and CBED analysis.
    • BF/DF imaging, including weak-beam conditions for dislocation/interface analysis.
    • STEM HAADF and chemical mapping.
    • TEM tomography.

    A good background in the use of SEM, EBSD and FIB, as well as in nanomechanical testing, will be strongly valued.

    Fluent English is required.

    More information and application at the following link: http://jobs.materials.imdea.org/offer/104


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  •  

    Exploring self-healing solutions for Aluminum source layers in Power Devices

     

     

    MITSUBISHI ELECTRIC R&D CENTRE EUROPE (1 allée de Beaulieu, CS 10806, 35708 Rennes Cedex 7, France,  http://www.mitsubishielectric-rce.eu/) and  CEMES - Centre d'élaboration de matériaux et d'études structurales -CNRS 29 Rue Jeanne Marvig, 31055 TOULOUSE Cedex 04 http://www.cemes.fr/) are looking for a PhD candidate for a 3 years contract, starting September -October 2019. 

    Context:

    Power electronics applications have expanded in many fields such as domotics or energy conversion, but their reliability is mostly critical in the transportation field and off-shore applications. Anticipating or even preventing their failure is a key technical issue.

    In recent years, several weak spots have been identified in the structure of modern Silicon-based power MOSFETs and IGBTs, and some solutions have been found to increase their resistance to disruption (solder, packaging...). However, the aging of the top metal source, mainly made of Aluminum or Aluminum alloy has persisted as an intrinsic phenomenon, which degrades the electrical performance of the device over time. The deterioration of the Al layer occurs through mechanisms that involve grain boundary diffusion, crack formation and surface oxidation, also driven by stresses arising from thermal mismatch between the metal and the silicon. Similar oxidizing cracks develop between the metallization and the wire bondings, leading to local failure of the device [2].

    References:

    1. D. Martineau, C. Levade, M. Legros, P. Dupuy, and T. Mazeaud. “Universal mechanisms of Al metallization ageing in power MOSFET devices.” In: Microelectronics Reliability 54.11 (2014), pp. 2432–2439.

     

    2. R. Ruffilli et al., Mechanisms of power module source metal degradation during electro- thermal aging. Microelectronics Reliability (2017).

     

    Objectives:

    The study will focus on the aluminum layer of the power device that interfaces the silicon die and the electrical circuit.

    The objective of this thesis is to find technical ways to slow down the mechanisms that cause the deterioration of the Aluminum layer, either by increasing the metallic contact between the wire bondings and the metal in the initial state and/or to restore this electrical contact during operation.

    From September 2019

    Mainly at the CEMES in Toulouse (85% time).

    Regular visits are planned to Mitsubishi Electric R&D Centre Europe, Rennes.     

    Education and experience required:

     • Engineer's degree or Master's degree with a focus in Materials Science

    • Simulation and programming softwares (COMSOL Multiphysics, Python)

    • Competence in materials characterization tools (TEM, FIB)

    • Strong general scientific knowledge and multidisciplinary opening (materials science, electrical, mechanical, thermal, chemical, mathematical)

    • Power electronics skills would be a plus

    • Communication and writing skills in English

    • Motivation and dynamism to work in a research environment

    • Ability to work in a multicultural and international environment

    Send your CV and motivation letter in a pdf format by mail (by specifying in object: your name and the reference JCB_PhD_2019CEMES):

    jobs@fr.merce.mee.com, marc.legros@cemes.fr

     


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  • The Laboratoire d’Étude des Microstructures et de Mécanique des Matériaux, LEM3 and The Max-Planck-Institut für Eisenforschung GmbH, MPIE are looking for a Postdoctoral Researcher on:

    "Influence of the microstructure on the internal stress field within grains."

    Your tasks:

    - You will perform detailed analyses of deformation microstructures. You will explore cutting-edge techniques for characterizing defects.

    - You will perform numerical simulations of microstructures evolution.

    - You will share your time between Metz (France) and Düsseldorf (Germany).

    - Your results will be discussed in the framework of fundamental deformation mechanisms of materials. 

    Your profile:

    - You should be a PhD in materials science. (PhD defense must be in 2016, 2017, 2018 or 2019)

    - You should have good knowledge of deformation physics and plasticity of materials.

    - Experience with electron microscopes is expected.

    - Experience with numerical simulations will be a plus.

    More information on subject and application are available in the following document: « Postdoc_LEM3_MPIE.pdf »

    Or please contact:

    Dr. Vincent TAUPIN : vincent.taupin@univ-lorraine.fr

    Dr. Antoine GUITTON : antoine.guitton@univ-lorraine.fr


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