PhD position: Thermo-mechanical assessment of TSV keep out zone in Si-Photonics optical device at IM2NP, Marseille, France
The objective of this work will be to participate to the integration of copper filled TSV in Siphotonics platform and to investigate the effect of TSV induced strain on optical components such as wave-guides, photo-diodes, and modulators. The quantification of the stresses in photonic Si is vital for the optimization of design and for the development of reliable 3D stacked structures.
ThePhD student task will be to define and integrate 3D test structures including TSV-Middle and optical elements in collaboration with Si-Photonics design team. Advanced characterizations (μ-Raman, nano-diffraction at synchrotron) will be carried out to extract strain maps in optical components around TSV.
Partners: ST Microelectronics Crolles, CEA Leti, IM2NP (Aix Marseille Univ & CNRS).
For further information, please contact:
Olivier Thomas (Olivier.Thomas@im2np.fr) or Stéphanie Escoubas (Stephanie.email@example.com)
Applications including a CV and a motivation letter should be sent to Olivier.Thomas@im2np.fr.
Deadline: June 20th, 2017.
More information can be found in the document below :
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